Flagship semiconductor plan aims for RM1tril in E&E exports by 2030

Flagship semiconductor plan aims for RM1tril in E&E exports by 2030

The plan builds on Malaysia’s status as the world’s sixth-largest semiconductor exporter, which saw electrical and electronics exports surpass RM600 billion in 2024.

semiconductor
Malaysia is home to chip-packaging plants for global giants like Intel, GlobalFoundries, and Infineon, making it a key part of the global semiconductor supply chain.
KUALA LUMPUR:
Malaysia is doubling down on its semiconductor ambitions with a flagship high-value, high-technology initiative aimed at pushing electrical and electronics (E&E) exports to RM1 trillion by 2030.

Citing Malaysia’s position as the world’s sixth-largest semiconductor exporter, with E&E exports surpassing RM600 billion last year, Prime Minister Anwar Ibrahim said the country wanted to continue sustaining this momentum.

“This momentum will be optimised through the implementation of a high value-high technology semiconductor industry flagship project, targeting RM1 trillion in E&E exports by 2030,” he said when tabling the 13th Malaysia Plan in the Dewan Rakyat today.

The effort is part of the National Semiconductor Strategy, launched in 2024 to help Malaysia evolve into a full-fledged design-to-fab semiconductor ecosystem.

Malaysia is currently home to a number of chip-packaging facilities for Intel Corp, GlobalFoundries Inc and Infineon Technologies AG, making it a key regional hub in the global supply chain.

Stay current - Follow FMT on WhatsApp, Google news and Telegram

Subscribe to our newsletter and get news delivered to your mailbox.